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NextFlex Awards $12 Million to 7 Projects Fueling Flexible Hybird Electronics Innovations in Healthcare, Avionics and Insfrastructure Monitoring

Projects include disposable health monitors that adhere to the skin, epidermal sensors for robotic knees, and conditional monitors for industry and infrastructure

San Jose, Calif. – NextFlex®, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, today announced $12 million (including $7M in cost-share contribution from participants) in funding for seven projects as part of its Project Call 3.0, fueling development of FHE projects that include epidermal sensors for robotic knees to rehabilitate soldiers and industrial workers, a sensor network to monitor and communicate the status of industrial systems and infrastructure, and flexible, “skin-like” health monitoring systems for healthcare patients and athletes.

The latest round of the highly successful Project Call program (which has awarded a total of over $59 million in development funding to date) challenged companies and universities to submit projects that achieved two objectives. The projects not only had to tackle industry-driven problems head on, but also develop components and methods that bridge key gaps in the FHE manufacturing process.

“With Project Call 3.0, we wanted to focus on the future of FHE and how it would be used to improve daily life,” said Malcolm Thompson, executive director of NextFlex. “The seven projects we’ve selected not only make exciting developments in fields like healthcare, avionics or heavy industry, but they’re creating building blocks upon which future researchers can create new applications with FHE, accelerating the pace of true FHE innovation.”

The seven projects awarded funding are:

Project Call 3.0 shows the continued momentum and interest from industry, academic, and government leaders for finding real-world applications for lightweight, low-cost, flexible and stretchable devices made possible through FHE – an intersection of printed circuity, passive devices and sensors, and thin, flexible silicon chips. To build on this momentum, NextFlex will be releasing Project Call 4.0 in August 2018.

For more information about NextFlex and the Project Call program, please click here. To receive notifications about Project Call 4.0, scroll to the bottom to “Sign Up For Updates.”


About Flexible Hybrid Electronics
FHE gives everyday products the power of silicon ICs by combining them with new and unique printing processes and new materials. The result: lightweight, low-cost, flexible, conformable, stretchable, and highly efficient smart products with innumerable uses for consumer, commercial, and military applications.

About NextFlex
NextFlex®, America’s Flexible Hybrid Electronics Manufacturing Institute, is a leading force in the Manufacturing USA network. Formed through a cooperative agreement between the U.S. Department of Defense and FlexTech Alliance, NextFlex is a consortium of companies, academic institutions, non-profits, and state, local, and federal governments with a shared goal of advancing U.S. manufacturing of FHE. Since its formation in 2015, NextFlex’s elite team of thought leaders, educators, problem solvers, and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap, and promote sustainable manufacturing ecosystems. Follow NextFlex on LinkedIn, Facebook, and Twitter.