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Die Handling Critical in Flex Electronics

Wearables require flexible hybrid electronics with die thinned to less than 30mum, and handling these ultrathin die is turning out to be a critical part of the manufacturing process.

Ultrathin die (<50 µm) have been in production for years in stacked 3D ICs. Building on this experience, NextFlex is developing new manufacturing processes that integrate ultrathin die onto flexible substrates.

Source: EE Times

Link: https://www.eetimes.com/author.asp?section_id=36&doc_id=1332383