NextFlex Workshop: AI for Hybrid Electronics

Join us for a half-day workshop to be held at UMass Boston on June 10 in conjunction with the TechBlick Conference, “The Future of Electronics Reshaped.” The NextFlex Workshop will be followed by a reception. Everyone is welcome to join.

Artificial intelligence and machine learning (AI/ML) are reshaping the landscape of hybrid electronics manufacturing and enabling the development of smarter edge devices through enhanced design, process control, and system intelligence. This meeting will explore how AI/ML tools accelerate circuit layout generation—particularly for complex 3D and conformal designs—optimize material selection and process parameters and enable real-time in situ monitoring with closed-loop control to improve yield and consistency. In addition, the integration of AI/ML into devices allows for local decision-making, predictive maintenance, dynamic system calibration, empowering responsive, autonomous operation at the point of use and supply chain logistics optimization.

Emphasis will be placed on the practical implementation of existing AI/ML technologies, not the development of novel algorithms, to improve both the manufacturability of hybrid electronics and the functionality of smart edge systems. Join us for interactive presentations and breakout sessions about the impacts of AI/ML models on hybrid electronics manufacturing and how the industrial base is utilizing these tools to enable faster technology adoption and commercialization.

The workshop will feature breakout sessions on the following topics:

Breakout 1: Design to Deployment
– Design
– Supply Chain
– Edge Devices

Breakout 2: Materials, Process, and Manufacturing
– Manufacturing Tool Control
– Material Development, Optimization, Process
– Automated Test & Qualification