NextFlex Workshop: Applications of Hybrid Electronics for Advanced Packaging

Registration Information

NextFlex members can attend the full three days for a discounted price of $199. If you are also a SEMI member, you do not need to use a code; the SEMI system will recognize you as a member if you log in with your SEMI credentials.

Workshop Description

This day and a half workshop will convene NextFlex members, industry experts, academic and government leaders, and others from the FHE manufacturing community to explore opportunities for flexible hybrid electronics manufacturing technologies in new and emerging areas of advanced semiconductor packaging. As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex seeks to align the ecosystem’s vision on how additive and flexible hybrid electronics manufacturing can shape the future of domestic packaging capabilities. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Agenda

Wednesday, January 18

1:00 pm – 2:00 pm – Arrival at NextFlex

1:15 pm – 2:00 pm – Informal Tours at NextFlex Headquarters

2:00 pm – 2:05 pm – Welcome to NextFlex – Dr. Malcolm Thompson, Executive Director, NextFlex

2:05 pm – 2:15 pm – Workshop Introduction – Dr. Scott Miller, Director of Technology, NextFlex

2:15 pm – 3:00 pm – Keynote – Dr. Tom Rucker, VP, Technology Development and Dir-Assembly and Test Technology, Intel

3:00 pm – 3:15 pm – Break

3:15 pm – 3:35 pm – Direct Write Interconnects – Dave Ramahi, Optomec

3:35 pm – 3:55 pm – Substrates and Build-up Layers – David Bolognia, Analog Devices

3:55 pm – 4:15 pm – Interposers, Bridges, & Architectures – Dr. Harvey Tsang, ARL

4:15 pm – 4:35 pm – Circuitization – Dr. Daniel Slep, ChemCubed

4:35 pm – 5:05 pm – CHIPS Act Opportunities for NextFlex – Dr. Art Wall, Director of Fab Operations, NextFlex

5:05 pm – 5:25 pm – Wrap Up & Instructions for Day 2 – Dr. Scott Miller, NextFlex

5:25 pm – 6:30 pm – Networking Reception

 

Thursday, January 19

8:00 am – 8:30 am – Arrival and Continental Breakfast

8:30 am – 8:40 am – Program Start: Welcome – Dr. Scott Miller, NextFlex

8:40 am – 9:00 am – Direct Write Interconnects – Dr. Dan Hines, Raytheon

9:00 am – 9:20 am – Substrates and Buildup Layers – Matt Neely, TTM Technologies

9:20 am – 9:30 am – Breakout Instructions – Dr. Scott Miller, NextFlex

9:30 am – 10:30 am – Breakout Session 1 – Give overview, introduce participants, and define topic 

Objective: Form breakout team; clarify topic; clarify scope (packaging problems to solve)​

• Direct Write Interconnects
  • Wire bond replacement, flip chip, high density interconnects, wafer-level bump printing, post-processing techniques (curing/sintering), conductive adhesives, low temperature solders
• Substrates and Buildup
  • Substrates (organic and additive), printed buildup layers, embedded die, encapsulation, thermal management)
• Interposers, Bridges & Architectures
  • Interposers (flexible, high density printed, non-silicon materials), flexible bridges in additive package, system in package, package on a package, antenna in package, sensor integration
•  Circuitization
  • Multi-material printing for multilayer, masked / seed layer print & plate, vias (boring, filling, plating)

10:30 am – 11:00 am – Coffee Break

11:00 am – 12:15 pm – Breakout Session 2 – Identify solutions

Objective: Identify solutions to problems identified in breakout 1 (collect ideas from participants).​

• Direct Write Interconnects
• Substrates and Buildup
• Interposers, Bridges & Architectures
• Circuitization

12:15 pm – 1:15 pm – Lunch

1:15 pm – 2:30 pm – Breakout Session 3 – Develop approaches/proposal topics

Objective: Prioritize solutions; group solutions into candidate proposals with high-level tasks, participants, outcomes​

• Direct Write Interconnects
• Substrates and Buildup
• Interposers, Bridges & Architectures
• Circuitization

2:30 pm – 3:00 pm – Break

3:00 pm – 4:00 pm – Breakout Session 4 – Summarize, wrap up, and build slides

Objective: Develop report-out material; identify next steps

• Direct Write Interconnects
• Substrates and Buildup
• Interposers, Bridges & Architectures
• Circuitization

4:00 pm – 5:00 pm – Breakout Reports & Definition of Next Steps by Breakout Leaders – Dr. Scott Miller, NextFlex

5:00 pm – Program Ends

Additional Event & Registration Information

This workshop is being held in conjunction with events sponsored by SEMI who will be processing all of the registration for the event.

NextFlex members can use code TW199NF for a discounted price of $199.

Government partners can use code TW100NF for a complimentary pass.

SEMI events include:

SEMI FlexTech FHE Technical Gap Analysis Workshop  – Tues. 1/17 – 8 am-12 noon
@ SEMI – 673 S. Milpitas Blvd – Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop – Tues. 1/17 – 1:00-5:00 pm
@ SEMI – 673 S. Milpitas Blvd – Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI Standards – FHE Standards Workshop – Wed 1/18 – 8:00am – 1:00pm
@ SEMI – 673 S. Milpitas Blvd – Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022. This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components. This workshop includes a continental breakfast and lunch.