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NextFlex Events

Bringing The FHE Community Together

NextFlex Workshop: Applications of Hybrid Electronics for Advanced Packaging


SEMI and NextFlex HQ (Milpitas and San Jose, CA)
Cost: $199 for NextFlex and SEMI Members, Non-members are $499
Anyone can attend this event. Pricing varies for NextFlex and SEMI Members

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Registration Information

NextFlex members can contact us for a discount code! NextFlex members who are also members of SEMI just need to log in to their SEMI account for the discount.

Workshop Description

This day and a half workshop will convene NextFlex members, industry experts, academic and government leaders, and others from the FHE manufacturing community to explore opportunities for flexible hybrid electronics manufacturing technologies in new and emerging areas of advanced semiconductor packaging. As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex seeks to align the ecosystem’s vision on how additive and flexible hybrid electronics manufacturing can shape the future of domestic packaging capabilities. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.

Breakout topics include:

 

    • Direct Write Interconnects
      • Wire bond replacement, flip chip, high density interconnects, wafer-level bump printing, post-processing techniques (curing/sintering), conductive adhesives, low temperature solders
    • Substrates
      • Substrates (organic and additive), printed buildup layers, embedded die, encapsulation, thermal management)
    • Interposers, Bridges & Architectures
      • Interposers (flexible, high density printed, non-silicon materials), flexible bridges in additive package, system in package, package on a package, antenna in package, sensor integration)
    • Circuitization
      • Multi-material printing for multilayer, masked / seed layer print & plate, vias (boring, filling, plating)

Cross-cutting breakout topics include reliability, technology transition, system demonstrators, environmental sustainability, workforce development, and design tools.

This workshop is being held in conjunction with events sponsored by SEMI who will be processing all of the registration for the event. NextFlex members can attend the full three days for a discounted price of $199. If a NextFlex member is also a SEMI member, you do not need to use a code, the SEMI system will recognize you as a member.

SEMI events include:

SEMI FlexTech FHE Technical Gap Analysis Workshop  – Tues. 1/17 – 8 am-12 noon
@ SEMI – 673 S. Milpitas Blvd – Milpitas, CA

During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.

SEMI NBMC Technical Gap Analysis Workshop – Tues. 1/17 – 1:00-5:00 pm
@ SEMI – 673 S. Milpitas Blvd – Milpitas, CA

Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives.  A networking reception will follow the workshop.

SEMI Standards – FHE Standards Workshop – Wed 1/18 – 8:00am – 1:00pm
@ SEMI – 673 S. Milpitas Blvd – Milpitas, CA

Many topics and paths were identified at the previous, very successful workshop in July 2022.  This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components.  This workshop includes a continental breakfast and lunch.

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