NextFlex News – April 2026

Dear NextFlex Members and Colleagues,

I recently had the opportunity to join many of you at the Defense Manufacturing Conference (DMC) 2026, an event that continues to serve as a critical forum for advancing the technologies and partnerships that underpin our nation’s defense industrial base. This year’s discussions reinforced a message we are hearing across the ecosystem: hybrid electronics is no longer an emerging concept—it is rapidly becoming a mission-critical capability.

The NextFlex Team at DMC 2026.

At DMC, NextFlex was proud to highlight the growing impact of hybrid electronics through a dedicated session on technology transition which was chaired by Dr. Scott Miller, our Director of Technology. Industry leaders from across our membership, including Lockheed Martin, Raytheon, and The Boeing Company, and more, shared compelling examples of how hybrid electronics is moving from research and development into real-world defense applications.

These presentations demonstrated tangible progress. From flexible RF circuits and advanced copper printing techniques to next-generation manufacturing approaches for RF systems, and corrosion health monitoring systems for structural integrity and lifecycle expansion, hybrid electronics enables new levels of performance, integration, and adaptability in defense platforms.

What stood out most was not just the innovation itself, but the pace of transition. Technologies that once lived in the lab are now being fielded and supporting applications such as structural health monitoring, resilient communications, and advanced sensing. This acceleration reflects the strength of the NextFlex collaborative model and the shared commitment across industry, government, and academia to deliver mission-ready solutions.

The broader context for this progress is equally important. The DMC platform conference brings together leaders focused on advancing manufacturing readiness and strengthening national security through innovation. Hybrid electronics is emerging as a key enabler, bridging advanced materials, novel manufacturing processes, and system-level integration.

At NextFlex, our mission remains clear: to accelerate the transition of hybrid electronics into scalable, manufacturable solutions that support both defense and commercial applications. This dual-use dynamic is one of our greatest strengths. The same technologies enabling low-profile antennas, embedded sensing, and lightweight conformal systems for defense are also opening new opportunities in healthcare, industrial monitoring, and consumer electronics.

Equally important is the role of our member community. The insights shared at DMC, from primes to suppliers to research organizations, underscore the importance of collaboration in overcoming manufacturing challenges and scaling these technologies to commercialization. No single organization can do this alone. It is the collective effort of the NextFlex manufacturing ecosystem that is driving meaningful progress.

As we look ahead, the momentum is clear. Hybrid electronics will play an increasingly central role in enabling resilient, adaptable, and high-performance systems for the defense community. Events like DMC are essential for aligning stakeholders, sharing lessons learned, and accelerating adoption.

Thank you to all our members who contributed to this important dialogue. Your leadership and innovation continue to shape the future of advanced manufacturing and national security.

Sincerely,

Dr. Dan Gamota
Executive Director, NextFlex