NextFlex News – March 2026

Expanding the Impact of Hybrid Electronics in 2026

Dear NextFlex friends and colleagues,

As we look ahead to the rest of 2026, hybrid electronics is rapidly evolving from an emerging technology to a critical capability. Across the Department of Defense and commercial markets alike, the ability to integrate electronics into flexible, lightweight, and conformal form factors is enabling systems that were previously difficult — or impossible — to achieve with conventional electronics.

At NextFlex, our mission remains clear: accelerate the transition of advanced electronics from research to real-world deployment. In the year ahead, we are focused on expanding the visibility, adoption, and impact of hybrid electronics across both defense and commercial sectors.

The field of hybrid electronics sits at the intersection of several technologies that are central to U.S. competitiveness, including advanced microelectronics packaging, heterogeneous integration, embedded electronics, and in-mold electronics. Together, these capabilities enable systems that are lighter, lower profile, and more adaptable—allowing electronics to be seamlessly integrated into platforms, equipment, and even wearable or medical applications.

We are already seeing this transformation in action. Applications such as smart glasses, wearable medical monitoring patches, and compact wireless modules like the NextFlex A21 flexible microcontroller platform demonstrate how hybrid electronics are expanding what engineers can design and deploy.

The implications for defense are significant. Technologies such as low-profile antennas, in-mold wire harnesses, additive RF structures, and low-SWaP radar systems are enabling new approaches to sensing, communications, and situational awareness. At the same time, these innovations have powerful commercial applications, from healthcare monitoring and industrial sensing to next-generation consumer electronics. This dual-use dynamic, advancing both national security and commercial innovation, is a defining strength of the hybrid electronics ecosystem.

A key priority for NextFlex in 2026 is increasing the visibility of hybrid electronics across the Department of Defense and the broader U.S. government technology landscape, while continuing to engage commercial partners that are driving adoption at scale. As the United States works to strengthen domestic microelectronics capabilities, hybrid electronics offers a powerful bridge between advanced materials, manufacturing innovation, and system integration.

Equally important is the strength of our member community. NextFlex brings together leaders from industry, government, and academia to accelerate innovation and transition technology into real-world applications.

The future of electronics will not be defined by rigid circuit boards alone. It will be shaped by systems that are embedded, adaptable, and integrated directly into the environments where they are needed most.

Hybrid electronics is helping make that future possible, and together, we are just getting started.

Sincerely,

Dr. Dan Gamota
NextFlex Executive Director