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NextFlex News – September 2022

Dear Members and Friends,

Last week NextFlex participated in the 33rd IEEE Electronics Packaging Symposium held at Binghamton University. Dr. Scott Miller, Director of Technology; Robert McManus, Engineering Manager, Software and Test; and Dr. Janos Veres, Director of Engineering, participated in the symposium. The event was organized by the IEEC and CAMM centers of Binghamton University (Integrated Electronics Engineering Center and Center of Advanced Microelectronics Manufacturing, respectively) together with the IEEE Electronics Packaging Society, GE and IBM. We were honored to be able to contribute to the symposium in a meaningful way.

Robert McManus of NextFlex (right) discusses FHE applications with a visitor.

Our Government Program Manager, Dr. Eric Forsythe, also participated in a panel titled, “North American Ecosystem for Advanced Packaging.” A highlight of the conference were presentations by NIST about the forthcoming CHIPS Act program. NextFlex participated in discussions about the importance of additive, compact manufacturing platforms for packaging and our capability to contribute to this effort. Several speakers from GE, Lockheed Martin, UMass Lowell and Binghamton University reported out on NextFlex projects. It was wonderful to see flexible hybrid electronics represented so well and to hear that workforce development activities will feature prominently in CHIPS Act programs. All in all, it was a great forum, and we were so pleased to be a part of it.

Look for us at the Massachusetts Manufacturing Mash-up at Polar Park in Worcester, MA, on Friday, September 16 where we will have a demo display table. If you attend, please stop in to say hello!


Malcolm J. Thompson, Ph.D.
NextFlex Executive Director