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Project Call 3.0 Preview

Project Call 3.0 (PC 3.0) is scheduled for release on Wednesday, May 31, 2017. Here’s what’s in store:

PC 3.0 will continue to focus on the areas identified in the Flexible Hyrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils.

Topic areas for this proposal include subsystem development, as well as development of manufacturing processes and/or solutions for capability gaps. Specifically, there are four Manufacturing Thrust Area (MTA) and three Technology Platform Demonstration (TPD) topics planned:

Project Call 3.0 is anticipated to award multiple projects at a value totaling approximately $14 million, comprised of $7 million in government funding and cost-share contribution from participants.

Learn more at the following events (links to register to be announced):

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