Project Call 2.0

Initiated in May of 2016, Project Call 2.0 focused on areas of greatest technical need emphasized in the FHE Manufacturing Roadmap developed by NextFlex member company subject matter experts, as follows:

• Ultra-thin die assembly for FHE
• Multi-process integration tool with real-time metrology
• Printing on complex surfaces
• FHE Process Design Kit (PDK)
• Mechanical test methods
• Flex-hybrid array antenna
• Asset monitoring for time-critical inventory
• AFRL: failure modes in wearable performance monitors
• Stand-alone workforce development

Fifty-nine preproposals were received, with 33 advancing to the full proposal round. Project Call 2.0 awarded 16 projects at a total value of $32M, comprised of cost-share contribution and $12M in government funding.