Project calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.
Project Call 3.0 (PC 3.0) focuses on areas identified in the Flexible Hybrid Electronics (FHE) Roadmap developed by NextFlex Technical Working Groups. This roadmap is developed by industry, government, nonprofit, and academic subject matter experts, and reviewed by the Institute’s Technical and Governing Councils.
Topic areas for this proposal include subsystem development, as well as development of manufacturing processes and/or solutions for capability gaps. Four Manufacturing Thrust Area (MTA) and three Technology Platform Demonstration (TPD) topics, in addition to an Agency Driven Project, are the focus of PC 3.0:
- Printed circuit elements for RF and high-speed applications
- Printed passives for FHE including materials, tools, and process documentation
- Z-axis interconnect and via formation
- Additive and semi-additive manufacturing methods for high density interconnects
- Control- and/or condition-based monitoring applications for physical or perishable assets
- Adaptive wearable or structural articles with soft robotics response
- Development of a low-cost, high-performing multi-sensor system integrated in a user-friendly “wear and forget” format for medical or worker safety applications
Agency Driven Project
- 3D component placement and interconnect equipment development
Through this project call, NextFlex will award multiple projects at a total value expected to exceed $14 million, including approximately $7 million in government funding.
Full details on submitting a proposal and all supporting documents can be found in the Project Call Reference Documents section.
|Project Call Announcement & Posting||5/31/2017|
|Project Call 3.0 Webinar||6/8/2017|
|Project Call 3.0 Proposer’s Networking (see below)||6/22/2017|
|Pre-Proposal Online Cover Sheet Due||7/5/2017|
|Pre-Proposal Submission Deadline||7/12/2017|
|Invitation for Full Proposal Submission||7/25/2017|
|Full Proposal Online Cover Sheet Due||8/23/2017|
|Full-Proposal Submission Deadline||8/30/2017|
|Technical Council Review||9/20/2017|
|Governing Council Review||10/4/2017|
Project Call 3.0 Webinar
On June 8, 2017, NextFlex hosted a webinar to review submission procedures and topics, and to answer questions regarding this latest project call.
Manufacturing Readiness Level (MRL) Webinar
On May 2016, NextFlex hosted a webinar on MRLs, including MRL background, classifications/substantiation, and how they can be used within NextFlex Project Call proposals.
Frequently Asked Questions
How long are projects expected to take?
Past projects have ranged from 9-24 months. The average is 16 months. Quicker execution of deliverables will be given priority.
Does scalable necessarily refer to high volume manufacturing? For example, is there an interest in soft robotics that are low-volume/customized?
While applications and soft robotics are not cookie-cutter type examples, the capability should exist to be produced in a cost-effective and easily replicable manner, e.g., not hand assembled. The definition of “scalable” can be answered individually as it pertains to soft robotics and certain projects.
How are costs expected to be shared among partnering companies?
The aggregate of the cost share must meet the requirements. The distribution of the elements between the members of the proposal team is to be determined by the proposing team itself.
What are the expected sources of the matching funds?
Cash or in-kind from participating organizations, companies, and other backers are all acceptable. There are organizations within states that have funds available for this purpose. Guidelines for reasonable forms of cost share are available in the Reference Documents section on this page “Cost Share Definitions and Guidance.” Still unsure? Contact NextFlex.
How long does it take to get a contract in place after notification of award?
Award invitations for PC 3.0 will be sent in early October. Most contracts should be in place by the end of 2017.