Special Study: Assessment of the Hybrid Electronic Ecosystem

Background

In Fall 2024, NextFlex commissioned a study to gain insight into the Hybrid Electronics (HE) manufacturing ecosystem along with the markets and plans for commercialization. Input was obtained from member and non-member companies to create a representative view of the current state of the HE manufacturing ecosystem. This was the initial gathering of data to assess the FHE ecosystem and has successfully established a baseline. From the data collected in this study, HE seems to be at a cusp of transitioning from an early-stage technical curiosity into a viable commercial reality.

The definition of Hybrid Electronics was provided to all participants as the field that exists at the intersection of printed and additively manufactured electronics with conventional semiconductor devices and discrete components. HE is broader, though, than is sometimes interpreted from this description, as HE also includes electronics that can stretch, bend and twist, those which are conformally built onto surfaces in three dimensions, and those which are additively manufactured in three dimensions, regardless of mechanical flexibility. Advanced semiconductor packaging and additive printed circuit board (PCB) manufacturing are areas of increasing focus as novel additive techniques provide distinct capabilities on both flexible and rigid substrates.

Participation

In this study, 57 companies participated with 22 being members of NextFlex. 18 were members of OEA, and 13 were members of SEMI. These companies represent a good cross-section of participation in the HE Ecosystem (Figure 1) and in the market segments they serve (Figure 2). This breadth of participation enhanced the assessment of the HE ecosystem as compiled.

Figure 1. Participant’s Position in the FHE Ecosystem. A total of 57 companies participated.

Figure 2. Market Segments Served by Participating Companies. Companies self-selected into particular market segments and offered new ones.

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