Webinar Recording: AI Opportunities in Electronics Manufacturing and Reliability
Miniaturization and heterogeneous integration technologies are increasing the complexity of semiconductor packaging, making AI essential for optimizing design, manufacturing, and reliability. On December 3, Professor Pradeep Lall gave insights into core concepts and practical applications, supported by packaging case studies that demonstrate how AI can address critical challenges.
The presentation included selected AI models and their application in analyzing process data for anomaly detection, root cause analysis, and real-time adjustment of process parameters. This webinar recording is particularly suited for packaging engineers, process specialists, reliability analysts, and technical managers who are looking to leverage AI for faster time-to-market, improved yield, and enhanced product reliability.
