An Interview with Dr. Mahjouri-Samani, NanoPrintek Founder and President

Question: Dr. Mahjouri-Samani, tell us about your role at NanoPrintek, Inc. and the focus of your organization.

Answer: I am the Founder and President of NanoPrintek, Inc., where I lead the development and commercialization of advanced additive nanomanufacturing platforms for printed electronics, semiconductors, and functional materials. Our core focus is enabling dry, ink-free, multi-material printing using laser-based processes that directly generate and deposit materials without inks, solvents, or masks. This allows us to print metals, semiconductors, dielectrics, composites, and alloys directly onto a wide range of substrates.

Our systems are designed to simplify the manufacturing process while enabling high-resolution, high-purity material deposition. We support applications ranging from research and prototyping to specialized production in automotive, aerospace, sensing, and hybrid electronic systems. Our goal is to provide scalable tools that expand what is possible with additive electronics nanomanufacturing.

Q: NanoPrintek is a newer member of NextFlex. What drew you to the FHE manufacturing community and what are you hoping to accomplish through your membership?

A: Flexible and Hybrid Electronics represents an important shift toward more adaptable and distributed manufacturing of electronic systems. The ability to integrate functionality onto flexible substrates and 3D objects enables new applications in wearable devices, aerospace, sensing, and conformal electronics.

We joined NextFlex because it brings together a unique ecosystem of industry, government, and academic partners working toward advancing additive and hybrid manufacturing. Our technology aligns closely with this mission, and we see strong opportunities to contribute to and benefit from collaborative development efforts.

Through our membership, we hope to demonstrate how dry additive nanomanufacturing can complement existing FHE processes, reduce manufacturing complexity, and enable new device architectures. We are particularly interested in collaborating on projects that accelerate adoption and enable on-demand fabrication of electronic systems.

Q: What is a key innovation that will enable widespread adoption of FHE and related technologies, and what application areas are you working in?

A: A key innovation needed for widespread adoption of FHE is simplifying the manufacturing workflow by reducing reliance on inks, masks, and multiple processing steps, as well as on the supply chain.

Our approach enables direct generation and deposition of functional materials from solid precursors, producing high-purity structures with strong adhesion and excellent performance. This enables more efficient, sustainable, and supply-chain-independent fabrication while expanding compatibility with flexible and unconventional substrates.

We are currently working in areas including flexible sensors, printed conductors and interconnects, hybrid electronics integration, semiconductors, energy devices, and aerospace electronics. Our technology is especially valuable in applications requiring rapid iteration, high material quality, and the integration of multiple materials within a single manufacturing platform, while enabling fully AI-enabled operations.

Q: What upcoming activities are you most excited about?

A: We are excited about expanding the deployment of our manufacturing platforms and collaborating with partners to demonstrate new applications in sensing, energy, aerospace, and hybrid electronic systems. We are also looking forward to engaging more deeply with the NextFlex community through technical collaboration and joint development opportunities. These efforts will help accelerate the transition of additive electronics manufacturing to broader industrial adoption.

Q: In what ways do you think NextFlex and flexible and hybrid electronics can impact microelectronics manufacturing and / or your own product development?

A: Flexible and hybrid electronics complement traditional semiconductor manufacturing by enabling additive integration of interconnects, sensors, and functional materials onto flexible and nontraditional substrates. This expands design flexibility and enables new system architectures.

For NanoPrintek, NextFlex provides valuable opportunities to collaborate with partners across the manufacturing ecosystem and ensure our technology aligns with emerging industry needs. More broadly, FHE will help enable more agile, distributed manufacturing models that improve supply chain resilience and accelerate innovation across aerospace, defense, automotive, healthcare, and advanced electronics.