Project Call 11.0: Resiliency and Efficiency

About

NextFlex Project Calls fulfill one of the Institute’s primary goals: fostering technology innovation and commercialization.

Project Call (PC) 11.0: Resiliency and Efficiency is the first part of the eleventh project call issued by NextFlex. Like the previous project calls, it is intended to advance the state of the art in manufacturing for hybrid electronics and to promote the strength, competitiveness, and interconnectedness of the U.S. manufacturing industrial base for hybrid electronics. Each NextFlex project call builds from and implements changes relative to past project calls, and all proposers should carefully read all sections of this guidebook to understand changes in proposal development, required content, submission, evaluation, eligibility, and selection criteria. Important considerations for PC 11.0: Resiliency and Efficiency:

• Proposal process will be 1-stage (straight to full proposal) – there is no pre-proposal round
• Discussion with NextFlex during proposal development is strongly encouraged to ensure that proposals align to the goals of the topics
• Projects are expected to be technically focused and of modest duration (maximum duration 15 months, by topic)
• Topic areas are broadly defined, allowing proposers to determine the specific subject of their proposal; proposals should explain the importance and relevance of the chosen subject
• Alignment of proposals to DoD Critical Technology Areas and other DoD priorities are strongly encouraged (for more information, see https://www.cto.mil/cta/)
• Projects that leverage prior NextFlex investments are encouraged. All projects should have meaningful impact on U.S. hybrid electronics manufacturing and technology.

Important Dates for PC 11.0: Resiliency and Efficiency:

• Cover sheets are due on May 13, 2026
• Full proposals are due by 5pm Pacific on May 20, 2026

Topics for PC 11.0: Resiliency and Efficiency include:

• Topic 11.1: Resilient Manufacturing of Hybrid Electronics and Printed Circuit Boards
• Topic 11.2: Demonstration of Hybrid Electronics for Installation Resiliency and Efficiency
• Topic 11.3: AI/ML-Enabled Materials and Process Data Infrastructure for Hybrid Electronics

PROJECT CALL REFERENCE DOCUMENTS

• • Project Call 11.0: Resiliency and Efficiency Guidebook
  • Project Call 11.0: Resiliency and Efficiency FAQs
  • Project Call 11.0: Resiliency and Efficiency Cover Sheet Submission Form
  • Project Call 11.0: Resiliency and Efficiency Proposal Submission Form
  • Cost Proposal Template
  • Project Call 11.0: Resiliency and Efficiency Summary PPT Template
  • Cost Share Definitions and Guidance
  • Hybrid Electronics Manufacturing Roadmap Summary
  • Manufacturing Readiness Level (MRL) Webinar
    In March 2023, NextFlex hosted a webinar on MRLs, including MRL & TRL background, classifications/substantiation, and how they can be used within NextFlex Project Call proposals. View Webinar Slides | View Recorded Session
  • Proposer’s Day and Teaming Event
    On March 26, 2026, NextFlex hosted the Proposer’s Day and Teaming Event webinar for PC 11.0: Resiliency and Efficiency. The teaming event provided attendees with the opportunity to share their proposal ideas, technical capabilities, and connect with potential project collaborators. View Webinar Slides | View Recorded Session