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Innovation Day 2026
June 9 @ 8:00 am – 7:00 pm
Innovation Day is NextFlex’s premier annual member event—bringing together leaders from industry, academia, and government to advance the future of hybrid electronics.
Innovation Day 2026 will unite the nation’s hybrid electronics ecosystem to showcase member-driven innovation, strengthen trusted networks, and accelerate the transition of emerging technologies into fieldable, manufacturable solutions that support both defense and commercial applications.
Why Attend Innovation Day?
Advance the Mission
Explore NextFlex- and member-led innovations that accelerate readiness, resilience, and modernization. Gain insight into the strategic direction of hybrid electronics and its role in meeting commercial, DoD, and national security priorities.
Strengthen the Ecosystem
Connect with peers across industry, academia, government, and the defense industrial base. Innovation Day is where relationships deepen and the hybrid electronics community drives the industry forward.
Catalyze Collaboration
Discover opportunities for collaborative partnerships—from early-stage concepts to scalable, deployable capabilities and workforce solutions.
Engage Trusted Networks
Participate in meaningful dialogue with DoD stakeholders, primes, SMEs, researchers, and educators in a member-focused environment designed to foster collaboration and impact.
Innovation Day Session Descriptions
Session 1: Innovation Built to Scale
Hybrid electronics innovations are reshaping both commercial markets and defense capabilities. This session highlights breakthrough materials, additive manufacturing approaches, advanced packaging, and system integration technologies designed for dual-use impact. Speakers will explore how innovations are being architected from the outset to meet commercial scalability requirements while satisfying the performance, reliability, and security demands of mission-critical defense applications.
Session 2: Delivering Impact Across Markets and Missions
Innovation achieves impact only when it reaches production and deployment. This session explores how hybrid electronics technologies transition into commercially viable products and mission-ready systems—highlighting strategies that align manufacturing scalability with defense reliability, security, and performance requirements.
Session 3: AI/ML for Hybrid Electronics: From Design to Manufacturing Intelligence
From materials discovery to system design and production optimization, artificial intelligence (AI) and machine learning (ML) are reshaping the hybrid electronics development pipeline. This session will feature perspectives from AI/ML innovators, electronics design companies, and advanced manufacturing equipment providers on how these tools are enabling smarter design, optimized manufacturing, and more efficient process control. Speakers/panelists will highlight real-world applications, data challenges, and opportunities for collaboration across the industrial base to accelerate the transition of emerging hybrid electronics technologies.
Register for Innovation Day now! Early bird rates apply until May 8.
NextFlex Member Only Sessions at TechBlick:
June 10 @ 2:05 PM
Session 4: Hybrid Electronics for Unmanned Systems: Enabling the Next Generation of Autonomous Platforms
As unmanned systems expand across air, land, sea, and multi-domain operations, advanced electronics are critical to enabling greater autonomy, sensing, communications, and mission endurance. This session will feature perspectives from government industry stakeholders on evolving operational needs and the role of hybrid electronics in supporting next-generation unmanned platforms. Speakers/panelists will discuss design challenges, manufacturing considerations, and collaboration opportunities that can accelerate the transition of innovative technologies into scalable capabilities for autonomous applications.
Session Chair: Dr. Benjamin Leever, AFRL
Confirmed Speakers:
- Dr. Nate Bode, Impossible Objects
- Rich Ormeno, Lockheed Martin
June 10 @ 4:10 PM
Session 5: Resilient Electronics: Advancing Systems for Challenging Operational Environments
Operating in contested, harsh, and constrained environments places unique demands on electronics systems, from manufacturing and materials constraints in austere environments to storage, platform integration, and power requirements. This session will explore resilient hybrid electronics for both defense and commercial applications. Speakers will highlight technology advances, integration challenges, and opportunities to accelerate the transition of innovative solutions into fieldable, manufacturable capabilities.
Session Chair: Dr. Pradeep Lall, Auburn University
Speakers:
- Dr. Cadré Francis, NASA
- Dr. Kenneth Church, Sciperio
- Ryan Hill, IS4S
- Kevin Durkee, Aptima
- Eric Marksz, Northrop Grumman
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Sponsorship Information
Why Sponsor Innovation Day?
Reach the Hybrid Electronics Ecosystem
Connect with leaders from the defense industrial base, advanced manufacturing companies, startups, research institutions, and government agencies.
Position Your Organization as a Technology Leader
Highlight your company’s capabilities and innovations to decision-makers shaping the future of hybrid electronics.
Strengthen Strategic Partnerships
Innovation Day is designed to foster collaboration and partnerships across the ecosystem—from early-stage research to scalable manufacturing solutions.
Engage with Influencers and Decision-Makers
Participate in discussions with DoD stakeholders, primes, SMEs, researchers, and educators in a focused member community.
Sponsorship Opportunities
Innovation Day offers four sponsorship tiers, each providing unique benefits and visibility throughout the event.
Opportunities include:
- Brand visibility across event marketing and signage
• Exhibit or demo presence
• Recognition during event sessions
• Networking access with attendees and speakers
• Opportunity to showcase technology and capabilities
If you are interested in learning more or are ready to commit to sponsorship, please contact us.
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