Webinar: AI Opportunities in Electronics Manufacturing and Reliability

Miniaturization and heterogeneous integration technologies are increasing the complexity of semiconductor packaging, making AI essential for optimizing design, manufacturing, and reliability. Participants in this webinar will gain insights into core concepts and practical applications, supported by packaging case studies that demonstrate how AI can address critical challenges. The presentation will include selected AI models and their application in analyzing process data for anomaly detection, root cause analysis, and real-time adjustment of process parameters. This webinar is particularly suited for packaging engineers, process specialists, reliability analysts, and technical managers who are looking to leverage AI for faster time-to-market, improved yield, and enhanced product reliability.

About the Speaker:

Pradeep Lall is the MacFarlane Endowed Distinguished Professor and Alumni Professor with the Department of Mechanical Engineering and Director of the Auburn University Electronics Packaging Research Institute. He holds a Joint Courtesy Appointment in the Department of Electrical and Computer Engineering. He serves as the Director of the Alabama Node of the NextFlex Manufacturing Institute. Prior to joining Auburn University, Dr. Lall worked for Motorola, focusing on various aspects of wireless communications products. He is the author and co-author of 2 books, 15 book chapters, and over 1000 journal and conference papers in the field of electronics reliability, manufacturing, and survivability. He holds three U.S. Patents, three Motorola Outstanding Innovation Awards, and five Motorola Engineering Awards. His publications have garnered over 13,000 citations, an H-index of 53, and an i10-index of 317. Dr. Lall is ranked in the highest quantile among the top 2 percent of scientific researchers worldwide, based on data compiled by Stanford University. The ranking system includes scientists in 20 fields and 174 sub-fields.