Skip to main content

Hybrid Electronics for Advanced Packaging: FHE Manufacturing Community Convenes at NextFlex

The FHE manufacturing community gathers at NextFlex to brainstorm and identify manufacturing solutions.

NextFlex hosted a workshop January 18-19 at its Technology Hub in San Jose, CA, designed to explore and align opportunities for hybrid electronics technologies in new and emerging areas of semiconductor packaging. Attended by 100 subject matter experts from industry, academia, and government, the workshop provided opportunities to brainstorm and prioritize solutions for how the industry can shape the future of U.S. packaging capabilities. The solutions that were identified will inform potential NextFlex Project Call topics, as well as proposals for various opportunities that may arise from the CHIPS and Science Act or other programs.


Attendees brainstorm solutions to advanced packaging manufacturing challenges.

Participants convened around four key theme areas: Direct Write Interconnects; Substrates and Build-up Layers; Interposers, Bridges & Architectures; and Circuitization. Breakout groups on each of these topics, led by pairs of members with manufacturing and development experience, were tasked with scoping manufacturing gaps, identifying potential solutions, and developing ideas that would help advance the technology through collaboration. Solutions that were identified included development programs, new tool capabilities, creation of new manufacturing facilities, and more. These discussions enabled the community to identify new potential partnerships, as well as ways to combine related ideas to solve bigger problems.

Feedback from the workshop was overwhelmingly positive, regarding both the technical focus and the approach to drilling down into the topics. Next steps include publishing a report from workshop for attendees and NextFlex members, completing specific recommendations in each of the topic areas, continuing discussions to further refine program concepts, and preparing to respond to funding opportunities that may come in the future.

Presentations have been posted to the Member Portal. To request NextFlex Member Portal access, click here. A webinar will be held at 10:00 am Pacific on February 15 to provide a summary of the workshop to all members. Click here to register.