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NextFlex News – April 2021 Newsletter

Dear Members and Friends,

Earlier this month, NextFlex held a round of member meetings that shared our vision of how we see flexible hybrid electronics, additive manufacturing, and advanced packaging evolving in the future. While there are many challenges ahead, we are confident that through our collaboration with members and others, we will not only rise together to meet those challenges, but we will also discover new opportunities along the way. The meetings provided members with project updates, government updates, and a chance to network together and with the NextFlex technical team. Members have asked for new ways to network with each other, particularly as the pandemic continues, so we were glad to help connect the community around important technical topics. Two of the breakout groups, Standards, Testing and Reliability and a potential new Technical Working Group on Automotive, made good progress on how to move forward. We were delighted that so many were able to participate, but if you missed it, all the recorded presentations are available for later viewing in the Member Portal.

A highlight of the meetings was, of course, the annual recognition of several key individuals who go above and beyond to help NextFlex achieve its mission. Those recognized received the designation as “NextFlex Fellow,” and received the award for their work in expanding learning programs nationally, guiding development of human health monitoring projects, and leading advanced manufacturing and flexible electronics from a materials and industry perspective.

This year’s NextFlex Fellow Award winners are:

Along with me, the NextFlex team thanks these individuals, as well as our past Fellow awardees, as they continue to make significant contributions toward furthering the development of flexible hybrid electronics and the advanced manufacturing ecosystem. Please join me in congratulating our 2021 NextFlex Fellows!


Malcolm J. Thompson, Ph.D.
Executive Director