NextFlex News – June 2026

Dear NextFlex Colleagues and Friends,

I want to extend my sincere thanks to everyone who joined us for Innovation Day 2026 at the Computer History Museum in Mountain View. This year’s event was one of our most successful to date, bringing together leaders from industry, academia, government, and the defense industrial base to showcase innovation, strengthen partnerships, and advance the future of hybrid electronics.

Innovation Day is designed to do more than highlight technology. It serves as a forum where our community comes together to exchange ideas, build trusted relationships, and accelerate the transition of emerging technologies into fieldable, manufacturable solutions that support both commercial and defense applications. This year’s program delivered on that mission through engaging technical sessions focused on scalable innovation, technology transition, and the growing role of artificial intelligence and machine learning in hybrid electronics design and manufacturing. Two member-only sessions embedded in the co-located “Electronics Reshaped” conference the following day focused on Hybrid Electronics for Unmanned Systems and Resilient Electronics for Challenging Operational Environments.

What makes Innovation Day special is the strength of the NextFlex manufacturing ecosystem. The discussions, demonstrations, and networking opportunities throughout the day reflected the collaborative spirit that has helped establish the United States as a global leader in advanced electronics manufacturing. The energy and engagement from our members, partners, and stakeholders were truly inspiring.

One of the highlights of the event was the induction of four outstanding leaders into the NextFlex Fellows program. We were honored to recognize Dr. Alkim Akyurtlu of UMass Lowell, Dr. Ahmed Busnaina of Northeastern University, Dr. Manos Tentzeris of Georgia Tech, and David Wiens of Siemens as our 2026 NextFlex Fellows. These individuals have made exceptional contributions to technology advancement, workforce development, ecosystem building, and industry leadership, helping strengthen both NextFlex and the broader advanced manufacturing community.

The Fellows program represents one of our highest honors, recognizing individuals whose dedication and leadership have had a lasting impact on our industry. This year’s inductees join an esteemed group of more than 40 previous Fellows whose contributions continue to shape the future of hybrid electronics and advanced manufacturing.

As I reflect on the success of Innovation Day 2026, I am reminded that our greatest strength is our community. The willingness of our members and partners to collaborate, share expertise, and tackle complex challenges together is what drives innovation forward. Thank you for helping make this year’s event such a success. I look forward to building on this momentum as we continue advancing the technologies, workforce, and partnerships that will define the future of electronics manufacturing in the U.S.

Sincerely,

Dan Gamota, Ph.D.
Executive Director, NextFlex