NextFlex News – May 2026

Dear NextFlex friends and supporters,

Today, hybrid electronics are delivering measurable impact across commercial and defense sectors, creating new opportunities for innovation, scalability, and supply chain resilience. One thing is becoming increasingly clear: innovation happens fastest when great minds come together with a shared purpose. That is why I am excited to invite you to join us for NextFlex Innovation Day 2026 on June 9 at the Computer History Museum in Mountain View, California.

Innovation Day is more than an event, it is where the hybrid electronics ecosystem comes together to strengthen relationships, exchange ideas, and accelerate technologies from concept to deployment. Each year, leaders from industry, academia, and government gather to explore the breakthroughs, partnerships, and manufacturing strategies shaping the future of our field.

This year’s program reflects both the urgency and opportunity before us. Sessions will explore how innovations are being designed for scale, how emerging technologies are transitioning into real-world applications, and how artificial intelligence and machine learning are transforming electronics design and manufacturing. These conversations are not theoretical, they are directly connected to the challenges and opportunities facing our nation’s industrial and defense capabilities today.

But the true value of Innovation Day goes beyond the presentations. The event creates space for meaningful collaboration across the ecosystem. Whether you are a startup developing a breakthrough technology, a manufacturer looking for scalable solutions, a researcher pursuing new applications, or a government stakeholder shaping future priorities, Innovation Day provides an unparalleled opportunity to engage with trusted partners and discover new pathways for collaboration.

Participation matters. The strength of the NextFlex community comes from the willingness of our members and partners to share insights, challenge assumptions, and work together to solve difficult problems. By attending and actively engaging in discussions, demonstrations, and networking opportunities, you help strengthen the connections that drive innovation forward and build a more resilient and competitive electronics manufacturing ecosystem.

This year’s event is also co-located with TechBlick’s Future of Electronics RESHAPED conference, bringing together a global audience focused on additive, printed, flexible, and hybrid electronics. Together, these events create a powerful platform for collaboration, visibility, and technology transition across commercial and defense markets.

I encourage you to register early, participate fully, and bring your ideas, expertise, and curiosity to the conversation. Innovation Day is an opportunity not only to learn about the future of hybrid electronics, but to help shape it.

I look forward to seeing you there.

Sincerely,

Dan Gamota
Executive Director, NextFlex