OverviewJoin us in celebrating 10 years of collaboration and innovation between the Ohio Technical Skills Innovation Network (Ohio TechNet), NextFlex, and Lorain County Community College.At this milestone event, industry leaders, […]
Join us for a half-day member-only meeting to be held at UMass Boston on June 10 in conjunction with the TechBlick Conference, "The Future of Electronics Reshaped."
Hybrid electronics are revolutionizing the automotive and aerospace industries by enabling sophisticated, lightweight, and highly efficient systems that enhance performance and safety.
At the recent NextFlex AI for Hybrid Electronics Workshop in Boston, leaders from across the industrial base came together to explore how artificial intelligence (AI) and machine learning (ML) are […]
Hybrid Electronics development demands precision across materials, printing, and process control — yet traditional methods rely heavily on manual inspection and trial-and-error optimization. In this talk, Dr. Jiaojiao Li, Co-Founder […]
Miniaturization and heterogeneous integration technologies are increasing the complexity of semiconductor packaging, making AI essential for optimizing design, manufacturing, and reliability. Participants in this webinar will gain insights into core […]
The role of artificial intelligence (AI) in electronics design has become increasingly important due to a combination of factors, including a workforce crunch, the explosion of complexity and cost, and […]
Innovation Day 2026 will unite the nation’s hybrid electronics ecosystem to showcase member-driven innovation, strengthen trusted networks, and accelerate the transition of emerging technologies into fieldable, manufacturable solutions that support both defense and commercial applications.
